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The reliability of SAC lead-free solder joints are believed to be greatly influenced by the interfacial intermetallic compounds (IMCs) between solders and substrates. Our previous works investigated the effects of minimal rare earth (RE) elements addition on the interfacial IMCs under different aging time. Experimental results showed that the appropriate RE content is 0.07wt% La in Sn-0.3Ag-0.7Cu...
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