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Unit warpage in Ball Grid Array (BGA) packages with different substrates due to coefficient of thermal expansion (CTE) and Young's Modulus mismatch was investigated. The effect of substrate materials on BGA packages warpage was analyzed. Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA) were used to measure Glass Transition Temperature (Tg) and CTE and Young's Modulus of the...
Package warpage is often a problem in surface mount reflow process especially for thin package. Large warpage prevents package solder balls to be connected to PCB pads and results in low process yield. In order to effectively minimize warpage in reflow process, this paper proposed a new approach to reduce package warpage by temporally bonding the back of the packaged component to a rigid plate. In...
The microelectronic packaging field is moving into the third dimension for miniaturization, low power consumption, and better performance. In this paper, we present a double-sided flip-chip (FC) organic substrate with a memory controller on one side of the package and 3-D stacked disaggregated memory chips on the other side of the package. This design allows the controller to interface with the DRAM...
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