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Package warpage is often a problem in surface mount reflow process especially for thin package. Large warpage prevents package solder balls to be connected to PCB pads and results in low process yield. In order to effectively minimize warpage in reflow process, this paper proposed a new approach to reduce package warpage by temporally bonding the back of the packaged component to a rigid plate. In...
A simple method to increase the adhesion strength between leadframe and epoxy molding compound (EMC) was reported in this paper. Cone-structured copper film was deposited on copper-based leadframe sheets by electroless plating. SEM observation of the as-prepared film indicates that cone size distinctly depends on plating time. Adhesion strength between EMC and cone-coated leadframe was measured by...
Moisture ingression in plastic packages generally occurs through delaminated interfaces between different materials. So the adhesion strength between molding compound and substrate is crucial to the plastic package reliability. In the present work, a sample preparation device was designed for molding compound adhesion test. A series of experiments has been done with this device. The results showed...
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