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The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
Study of diffusion mechanism in low-temperature bonding method based on Cu microcones is reported. A Sn layer was electrodeposited on the Cu microcones and the electrodeposited Cu substrate then annealing at bonding temperature 463 K. IMC grains of Sn/Cu-microcones diffusion samples grew slow with smaller size. The special morphology of Cu microcones was beneficial for the growth of intermetallic...
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