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The traditional wafer level packages (WLPs) are fan-in redistribution layer (RDL) lay-out design; it may not be able to meet the high pin-count handheld device requirement. So the new fan-out wafer level packages (FOWLPs) are emerged in the last few years. The fan-out WLP starts with the reconfiguration dies on carrier and embeds die by molded compound. The molded reconstituted wafer forms a compound...
In recently years, the continued demand for electronic systems and subsystems with more functionality, higher electrical performance, smaller size and lower cost, the conventional packaging and interconnect technologies already can not be met for it's requirement, so system-in-package (SiP) modules have been growing rapidly. As a packaging technology platform, SiP allows a high degree of flexibility,...
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