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Thus far, there is a severe lack of understanding about interfacial fracture and impact behavior of the microscale lead-free solder interconnects. In this study, the finite element simulation and analytical method were used to characterize the interfacial fracture and impact behavior at the interfaces of the microscale Sn-Ag-Cu solder joints. The intersection of a linear microcrack tip upon Sn-Ag-Cu...
Understanding of interface fracture behavior of the solder joints has long been significant in reliability evaluation of electronic components and packages. The experimental and finite element methods were employed to characterize the fracture performance of "Cu wire/solder/Cu wire" sandwich structured butt microscale solder joints with different sizes (75 to 425 mum in thickness and 200...
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