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It causes great challenge to the ordinary method to test the performance of the die when it comes to high frequency like 40GHz, especially for the optical die with some peripheral units, which causes extra difficulties with probes on the test bench. For the discontinuity of the impendence causes great loss for high-frequency signal, and it is difficult to place the die and the optical peripheral units...
Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. A novel fabrication technology using micro glass cavities for wafer level hermetic MEMS packaging including accelerometer or gyroscope will be presented. The micro cavities were fabricated by a hot-forming process using Pyrex 7740 since its coefficient of thermal...
To improve the image resolution of thermal imagers, which image objects by uncooled Focal Plane Arrays (FPAs) made up of two-dimension Infra-red (IR) detector arrays, detector size is decreased, and this results in the reduction of detector IR absorber area . However, reduction of IR absorber area may affect IR detector's sensitivity accordingly. In order to reduce the detector size without reducing...
A novel foaming process to fabricate wafer-level micro glass objects including bubbles and runners for MEMS packaging was studied. Firstly shallow cavities were wet etched fast on the surface of a silicon wafer. CaCO3 powders were placed in the silicon cavities. Then the cavities were sealed with a glass wafer by anodic bonding. The bonded wafers were then heated up, and the gas released by CaCO3...
Hermetic or vacuum packaging to maintain a controllable cavity pressure and low costs are required by many MEMS devices having moving parts. In this paper we propose a hot-forming process of fabricating micro glass cavity arrays for wafer-level and hermetic packaging of MEMS. First, the principle of the hot-forming process was discussed. Then, the hot-forming process for preparing cavity arrays in...
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