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Firstly, the theoretical model of polystyrene external thermal insulation material fires under conditions of window fire was put forward, the equations that calculate the important characteristic parameters of these fires such as the spread height, spread rate and ignition time were derived, and the relevant analyses were preliminarily made. Secondly, on the basis of theoretical analyses, the medium...
This paper proposes a new prediction method for electromigration induced void generation of solder bumps in a wafer level chip scale package (WL-CSP). The methodology is developed based on discretized residual weight method (RWM) in a user-defined finite element analysis (FEA) framework to solve the local electromigration governing equation with the variable of atomic concentration. The local solution...
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