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In this paper, we presented fabrication of nickel metal mold with 45?? tilted surfaces on both waveguide ends through electroplating process. To obtain 45?? angle, SU-8 was exposed under D.I. water, with repeatable 0.5?? error.
This paper presents the latest progress toward fully embedded board-level optical interconnects in the aspect of waveguide fabrication and device integration. A one-step pattern transfer method is used to form a large cross-section multimode waveguide array with 45deg micromirrors by silicon hard molding method. Optimized by a novel spin-coating surface smoothing method for the master mold, the waveguide...
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