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In this paper, we demonstrate a 3D monolithic integrated thermoelectric IR sensor by using CMOS-MEMS technology. Since CMOS technology is a plane process, wafer-level packaging is used to further improve the system integration density. Both the circuit interface and IR filter are integrated in the thermoelectric IR sensor. In the vertical direction, IR filter is integrated with IR sensor to miniaturize...
A simple mass producible uncooled thermoelectric infrared microsensor has been designed and fabricated. To improve the cost-efficiency, an advanced micromachining process, which combines wet anisotropic pre-etching and dry isotropic post-etching, is adopted for the sensor fabrication. The wet anisotropic pre-etching removes bulk silicon from back-side and forms a thin silicon membrane...
This paper presents a hybrid silicon etching processing technique for removing the entire bulk silicon to release microstructure. The proposed method that combines a back-side wet anisotropic pre-etching and a front-side XeF2 dry isotropic post-etching differs from previous works in silicon micromachining. Wet anisotropic pre-etching enhances the low-cost of the proposed method while the XeF2 dry...
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