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Quantum dots (QDs) have been developed as a promising light-converting material for light-emitting diodes (LEDs). However, QDs-polymer film always shows bad thermal performance. In this paper, a new designed structure of QDs-polymer film via electrospinning was proposed to enhance the thermal conductivity of the QDs-polymer film. After the measurement of density, specific heat and thermal diffusivity,...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
The effective thermal conductivity (ETC) of silicone matrix embedded with particulate phosphors is of great importance in the thermal management of white light-emitting diode (LED) packages, not only because the mixture provides the heat dissipation path but also because the phosphors may generate heat as well. In this paper, a 2D/3D unit cell method with considering interface resistance was proposed...
The effective thermal conductivity (ETC) of silicone matrix embedded with particulate phosphors is of great importance in the thermal management of white light-emitting diode (LED) packages, not only because the mixture provides the heat dissipation path but also because the phosphors may generate heat as well. In this paper, a 2D/3D unit cell method with considering interface resistance was proposed...
Defects could be inevitably generated during the growth or the artificial operation of graphene. The existence of structure defects could be influence to excellent properties of graphene. Non-equilibrium molecular dynamics (NEMD) simulations was used to investigate the thermal conductivity of graphene with single vacancy (SV) and stone-wales (SW) defects. Dependence of temperature showed that thermal...
The thermal conductivity of finite-length singlewalled carbon nanotubes (SWCNTs) was investigated using non-equilibrium molecular dynamics (NEMD) simulations. The temperature and diameter dependence of thermal conductivity was studied in this paper. In this work, thermal conductivity of SWCNTs with the length of 24.5nm and different diameter — (6, 6), (7, 7), (8, 8), (10, 10), (15, 15) was studied...
The present paper is focused on the characteristics study of thermal flow sensors in different shapes. Based on the thermal flow sensor design theory, a series of thermal flow sensors with different shapes were developed. Compared with the existing model, the sensitivity of the curve design was also studied through thermal analysis. The results reveal different temperature distributions in different...
As one type of the chip attachment materials, the solder layer inside the light-emitting diode (LED) packages can not only bond the chips to the substrate tightly, but also play the role of thermal interface material (TIM). Therefore, it makes a great influence on the thermal performance LED packages, especially in high density chip-array LED packaging. The solder layer has become one of the dominant...
Direct bonded copper (DBC) as heat spreader and highly thermal conductive adhesives as thermal interface materials (TIMs), the light performances of packaged high-brightness light-emitting diodes (HB-LEDs) were tested. The results indicated that the light output power of LED modules increased with the thermal conductivities of TIMs. Apart from its low bulk thermal resistance, highly thermal conductive...
Analytical solution is established to calculate equivalent thermal resistances of the through silicon via (TSV) structure in both z direction and x y directions and is verified by the finite element simulation. The effects of the structural parameters such as the thickness of die, the diameter of copper via and the pitch of the copper via on the equivalent thermal conductivity of composite TSV structure...
An experimental setup to measure the thermal contact conductance across solid/solid interface is described in this paper. This setup was built at room temperature, it does not need vacuum environment and can be used in normal pressure environment. An experimental investigation of thermal contact resistance of two brass columns was conducted under different conditions, which were classified as four...
Thermal management of a super computer is one key point in the whole system design. The working temperature of electronic device in the super computer is the important parameter to show the cooling performance. Thermal design was conducted for one super computer. The experiment was conducted to test the temperature of an ultrascalable computing platform in order to evaluate the cooling performance,...
As thermal performance is importance for high-power LED devices, there exists a need to build a validated model to clarify the thermal transfer mechanisms in the LED chip in terms of the chip materials and structures. High-power LED was numerically investigated using the finite element method. A series of substrate materials with different thermal conductivity and thicknesses were studied. The impact...
In this paper, a micro jet based cooling system for the thermal management of high power LEDs is briefly introduced. Our experiments have demonstrated that the optimization on micro jet device is strongly needed for improving the system performance. To realize the above attempt, numerical optimization on micro jet device is conducted in details in this paper. The comparison between simulation and...
Silicon on insulator (SOI) is becoming a more favorable technology to make membrane in MEMS as compared to traditional poly-silicon due to its high temperature capability and more uniformity in controlling its geometry. In our study, a high temperature pressure sensor is designed based on a SOI based MEMS chip bonded on the cantilever beam. A unique structure is designed to shelter the thermal shock...
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