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HV n-/p-LDMOS devices with the source-side extending into bulk-region to evaluate the electrostatic-discharge (ESD) protection robustness by a TSMC 0.25 µm 60 V process are investigated in this paper. After a systematic analysis, the trigger voltage (Vt1) values of the n-LDMOS with the source-side extending into the bulk-end either by uniformly or non-uniformly distributed manners that had decreased...
In this paper, Electrostatic-Discharge (ESD) reliability study of 45-V HV pLDMOS devices with the source-side discrete islands is investigated. A pure pLDMOS transistor is always frail in ESD harms (It2= 0.107-A). However, if a pLDMOS device with two embedded SCRs (drain side npn-arranged); the corresponding It2 current can be upgraded to 0.644-A. Furthermore, as a pLDMOS-SCR (npn-arranged stripe...
Repercussions on the reliability capability and electrical performance of power p-channel LDMOS devices by different discrete-distributed architectures in the drainside are investigated in this paper. Here, in order to effectively improve the reliability issues, a drain-side "NPN" and "PNP" styles of pLDMOS-SCR with some discrete-distributed areas arrangement are fabricated by...
In this paper, we propose a novel asymmetrical 11T SRAM cell design that has fault correction capability. In addition, the Layout design through Error-Aware transistor Positioning (LEAP) technique is adopted in designing the layout of this proposed 11T cell. The area of the proposed 11T cell without using LEAP technique (regular 11T) is 76% larger than that of traditional 6T cell and 16% larger than...
In general, the antielectrostatic discharge (ESD) ability of a high voltage (HV) <sc>mosfet</sc> device will be very low if it is not optimized through the addition of reliability engineering. Accordingly, in this paper, some embedded superjunction (SJ) device under tests (DUTs) of 45-V HV n-channel lateral-diffused MOS (nLDMOS) are developed, which offer a low on-resistance as compared...
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