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With the continuous improvement of system integration, 3-D packages are becoming effective solutions for lighter, thinner, shorter, and smaller electronic products. Meanwhile, packaging engineers are faced with serious signal integrity challenges. Especially significant intrasystem electromagnetic interference (EMI) problems are aggravated for shortened distance between noise sources and sensitive...
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
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