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Failure behaviors of ball grid array (BGA) solder ball joints under various loading conditions of high-speed shear test were investigated with an experimental and non-linear 3-dimensional finite element modeling work. A representative Pb-free solder alloy, Sn-3.0Ag-0.5Cu, was employed in this study. Far greater shear forces were measured by high-speed shear test than by low-speed shear test. The shear...
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