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Three-dimensional (3D) chip integration with through-silicon-vias (TSV's) can enable system benefits of enhanced performance, power efficiency, and cost reduction leveraging micro-architecture designs such as 2.5D silicon packages and 3D die stacks. 2.5D silicon packages and 3D die stacks structures integrated in modules each have unique technical challenges but each can provide system benefits including...
(Ba, Sr)TiO3 (BST) ceramic thin films have attained a presence in small-signal microelectronics applications due to their "dual-high" characteristics (high dielectric constant and high breakdown strength), which are essential in producing high energy density capacitors. In this paper we investigate the potential application of BST films to high voltage, high energy density capacitors in...
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