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Elelctrochemical migration (ECM) test was conducted for fine pitch flip-chip micro bump interconnect. Two kinds of micro bump. i. e., Cu post with SnAg solder and Cu under bump metallization (UBM) with SnAg solder bumps in 50 and 100 ??m pitch with non clean flux were used for chip interconnection. The test was conducted under 85??C/85H condition with various biases. The results indicated that for...
Electromigration (EM) of micro bumps of 50 mum pitch was studied using four-point Kelvin structure. Two kinds of bumps, i. e., SnAg solder bump and Cu post with SnAg solder were tested. These bumps with thick Cu under bump metallization (UBM) were bonded with electroless Ni/Au (ENIG) pads. The results showed different EM features comparing with larger flip chip joints. Under various test temperatures...
Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps with 25 ??m in pitch are fabricated at wafer level by electroplating method and the total thicknesses of the platted Cu and Sn are 10 ??m. After plating, the micro bumps on the Si chip are reflowed at 265??C and the variation of bump height measured...
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