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It was found that Bi particles, with a diameter of 100 nm, precipitated along Cu3Sn/Cu interface and Bi crystallites dispersed in Cu3Sn layer in 42Sn58Bi/Cu microelectronic interconnect, when it was aged at 120 °C for 7 days. The mechanism for Bi redistribution like this was discussed. Cu6Sn5 turned into Cu3Sn by Cu diffusion that is dominant in Sn/Cu inter-diffusion during the aging process. Bi precipitation...
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