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Low-temperature silver sintering technology, which has been proven to be a promising die-attach solution, was extended to bonding large substrates. Strong bonding strengths for substrates greater than 25 mm × 50 mm were achieved by sintering a nanosilver paste at temperatures below 270°C with less than 5 MPa pressure. To characterize thermal performance of the substrate-attach interface, we applied...
The online temperature measurement technology is analyzed and verified in this paper based on power supplied by the inductive current and wireless communication technique combined with the structure and principle of disconnector, solving problems in the online temperature measure system such as wireless data transmission, sensor operating supply and equipment high reliability in an environment of...
Ceramics coatings are materials widely used in gas turbines to provide thermal shielding of superalloy materials against excessive turbine temperatures. However, measurement of their surface temperatures using conventional radiation thermometers, more so in the presence of high ambient radiation and low emissivity is quite challenging. A multispectral method employing curve fitting technique to measure...
Demands for higher power density and reliability on power electronics systems are driving the need for development of high-temperature packaging solutions. Existing power module packaging technologies that rely on lead-tin or lead-free die-attach solders and alumina direct-bond-copper (DBC) insulated substrates are limited to 125°C junction temperature for reliable module operation. This is because...
Accurate measurement of gas turbine blades’ temperature is one of the greatest challenges encountered in gas turbine temperature measurements. Within an enclosed gas turbine environment with surfaces of varying temperature and low emissivities, a new challenge is introduced into the use of radiation thermometers due to the problem of reflection error. A method for correcting this error has been proposed...
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