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Coefficient of thermal expansion (CTE) mismatch between an underfill encapsulant material and integrated circuit chips mounted on a substrate is the major reason for device failure in a fan-out wafer-level packaging (FOWLP) assembly. In this paper, a variety of moldable polymer composite systems with evenly dispersed dielectric nanoparticles or microparticles and minimal cure shrinkage for FOWLP assemblies...
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