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An incremental crack extension procedure is implemented for simulating the growth of an interface defect in an electronic flip-chip device subjected to fatigue temperature cycling. The distributions of fracture mechanics parameters including the strain energy release rate, the stress intensity factors and phase angles along the curvilinear front of an embedded corner defect on the interface of silicon...
Summary. An analysis is performed to study the momentum, heat and mass transfer characteristics of MHD natural convection flow over a permeable, inclined surface with variable wall temperature and concentration, taking into consideration the effects of ohmic heating and viscous dissipation. Power-law temperature and concentration variations are assumed at the inclined surface. The resulting governing...
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