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Roadways supported by bolts contain support structures that are built into the rock surrounding the roadway, referred to as reinforced rocks in this paper. Using physical model simulation, the paper investigates the bearing characteristics of the reinforced rock under different bolt parameters with incrementally increased load. The experimental results show that the stress at the measurement point...
In this study, the design, fabrication, and calibration of the piezoresistive stress sensors [1–18] embedded in a TSV (through silicon via) interposer in a 300mm wafer are investigated. The results presented herein should be useful for the development of 3D integration such as measuring the strength of the TSV device and interposer wafers, during and after all the processes such as wafer thinning,...
In this study, a very low-cost silicon interposer with many through-silicon holes (TSHs) for 3D IC integration system-inpackage (SiP) applications is proposed. Unlike TSVs (through-silicon vias), the uniqueness of this design is there is not the dielectric layer, barrier layer, seed layer, filled Cu, and thus CMP and TSV Cu reveal are not necessary for the TSHs. The vertical interconnects between...
This paper proposes a novel three-phase interleaved high step-up converter suitable for electric vehicle applications. By integrating an auxiliary circuit, the proposed three-phase converter can achieve a higher voltage-boosting ratio than that of the conventional boost converter and possess lower duty cycle, leading to significantly reduced diode reverse recovery, voltage ratings of power devices...
The weight and length of three directions of calcareous mudstone after infiltrated with water in different period of time were measured by using electronic balance and vernier caliper. The results show that the calcareous mudstone expansion strain is proportional to volume and mass water content. It was showed from the rock SEM picture that the structure of expansion rock was loose when infiltrated...
The present paper studies the thermo-mechanical performance of thermoelectric modules by utilizing the Finite Element Analysis FEA simulation software ANSYS. A typical type TEG device with 32 pairs of legs was constructed. Three different thickness for the pads with 100um, 500um, and 1000um were given for investigating the geometry effect. The thermo-electric results got well confirmed compared with...
The infrared radiation experiments on bolt and rock in the process of loading were carried out. The results show that the infrared radiation temperatures rise wholly and uniformly before stress peak with increase of loading. The bolted rock presents local dissimilation in the thermal image after stress peak. The multi-layer round infrared radiation isothermal lines is formed around bolt. The temperature...
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