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Flip-chip packaging on organic substrate has been used widely as a promising package technology for the next generation of electronic devices. However, due to its numerous interfaces (i.e. die/passivation, passivation/underfill, underfill/solder mask, and solder mask/circuit board), it is more susceptible to a variety of complexworking and testing environments, delamination can easily take place in...
Reliability problems heavily hinder light-emitting diode (LED), especially high brightness LED, from developing rapidly and putting into mass production. One of the most important reasons is that it has so many interfaces which are always the weakest places. LED chip's working temperature is about 90°C and the high mismatch of coefficient of expansion of different materials can inevitably cause failures,...
Due to its many advantages over traditional 3D packaging technology, through silicon via (TSVs) is being widely used. However, there are still a variety of obstacles hindering it from being developed rapidly. One of them is the huge thermal stress induced by big CTE mismatch between silicon and copper, which would even induce interfacial delamination. In this paper, thermal stress is evaluated first...
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