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RT-LAB simulation platform shows various abnormities in its application of complex electromechanical simulation system, which cause difficulty in operation. Aiming at these problems, this paper has described the abnormal phenomena, analyzed the reasons and presented the solutions. Time consumptions of communication blocks and digital IO blocks takes up a large proportion of simulation step time, which...
Compliant interconnects are able to mechanically decouple die from substrate and are helpful in reducing thermally-induced stresses in the die. In this paper, we report drop-test modeling of die-substrate assemblies with compliant interconnects. Simulations using explicit ANSYS/LS-DYNA® solver were carried out to mimic typical experimental conditions and to gain a better understanding of the overall...
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