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This paper presents a high energy-efficiency and high bandwidth-density dielectric waveguide based sub-THz interconnect. A bumpless flip-channel packaged nearfield coupled transition based channel together with the holistic active circuit design scheme boosts the energy efficiency to the record based on the authors' best knowledge. The channel demonstrates the transmission loss of 0.04 dB/mm and the...
This paper presents a novel dielectric waveguide based G-band interconnect. By using a new transition of microstrip line to dielectric waveguide, the interconnect achieves low insertion loss and wide bandwidth. The measured minimum insertion loss is 4.9 dB with 9.7 GHz 1-dB bandwidth. Besides, the structure is based on standard micromachined processing and easy to integrate with conventional packaging.
This paper presents a 94 GHz compact receiver module which is composed of LO module and down-conversion module. The LO module consists of an oscillator, an active frequency doubler. The down-conversion module includes a low-noise amplifier (LNA), a down-conversion mixer. Modified waveguide to microstrip H-plane probe transition is proposed and obtains good results. The receiver module allows the whole...
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