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Since its introduction in the early 1990s, plastic ball grid array (PBGA) package had become the ldquopackage of choicerdquo due to its good electrical performance, lower cost, high assembly yield and self-alignment during board assembly process. Thermo-mechanical behavior of PBGA is highly dependent on the properties of the constituent components. The relative mechanical compliances and thermal expansion...
Integrated Heat Spreader (IHS) lids are increasingly being used in flip-chip package technology to enhance power and thermal capabilities. Adequate adhesion of the thermal interface material (TIM) and lid sealant materials are required to not only provide a continuous thermal interface, but also to permit manufacturability. This paper outlines criteria to aid in the material selection process for...
The study of polymers used in electrical insulation of wiring is important to the aerospace industry due to potential loss of life and aircraft in the event of an electrical fire caused by breakdown of wiring insulation. In this work, the effect of thermal exposure on the permittivity of PTFE is studied in order to examine the feasibility of developing of a capacitive nondestructive testing method...
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