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Recently, design of Flip Chip (FC) Package is changing with the higher density of the Package. Conventional process with Capillary Underfill (CUF) is not applicable to PKGs such as 3D and chip stacked types. To solve these problems, other processes are being developed in which an encapsulant is applied on a substrate before bonding IC. One of those is the process with Non Conductive Film (NCF). In...
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