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This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. The cross section of a PCB via is fabricated in PMMA to allow optical access to the sample. Fluid flow within two 1:1 aspect ratio blind micro-vias, one with straight side walls and the other with tapered side walls were...
Polyimide (PI) has been extensively investigated as matrix for blends in the search of novel materials for microelectronics and engineering. Tetraethoxysilane (TEOS) is used as precursor for inorganic/organic hybrid material. The processing of PI with TEOS in thin film form offers considerable advantages to the state-of-the art for developing low dielectric constant materials with improved mechanical...
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