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Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening due to the combined effect of thermal and mechanical stimuli during service and storage. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions...
There are two different types of damage resulting from plasma etching (oxide charging damage and plasma edge damage) which can degrade the reliability of CMOS devices. The oxide charging damage is due to plasma induced Fowler-Nordheim current flowing through gate oxide, while edge damage is due to direct plasma exposure during the poly-Si overetch period. This paper addresses the influence of plasma...
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