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In this paper, transient behavior of DTSCRs is captured and analyzed using high speed measurement with VFTLP. It is possible to use this data to properly design for CDM performance of final product while maximizing performance.
Predicting the fatigue life of solder interconnections is a challenge due to the complex nonlinear behavior of solder alloys and the load history. Long experience with Sn-Pb solder alloys together with empirical fatigue life models such as the Coffin-Manson rule have helped us identify reliable choices among package design alternatives. However, for the currently popular Pb-free choice of SnAgCu solder...
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