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An Ag spot/full nickel and nickel phosphorus (NiNiP)-plated Cu leadframe without the anti-tarnish layer was used for aluminum wire bonding in power packages. Two periods of shelf-life, namely 7 months and 13 months, of the leadframe were studied in terms of processability (die attachment and wire bonding) and package reliability. It was found that the leadframe with 7-month shelf-life showed positive...
Ar plasma was employed to remove/reduce the oxidation of two typical types of bond pad surfaces, namely aluminum (Al) surface and gold (Au)-coated palladium (Pd) surface, prior to Au wire-bonding process. Field emission scanning electron microscopy (FESEM) and Auger electron spectroscopy (AES) were employed to characterize the bond pad surfaces without and with the plasma cleaning. Processability...
A rotary MRF (magnetorheological fluids) damper is introduced in tension control systems. An experimental tension control system is designed by using the MRF damper as tension control actuator. Control strategies of the tension control system are studied. A fuzzy-PID feedback controller for the tension control system is constructed, modeled, and numerically simulated by means of MATLAB/ SIMULINK,...
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