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AZ31B Mg alloy and 6061 Al alloy are joined using low-temperature soldering with Sn–30Zn–xCe solder alloy. The effect of Ce content in Sn–30Zn–xCe solders on microstructure evolution and mechanical properties of the different brazed joints are investigated. The experimental results show that adding appropriate amount of Ce into Sn–30Zn solder is conducive to decreasing the amount of Mg2Sn intermetallic...
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