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As multiple layers of planar device are stacked to alleviate signal delay problem and reduce chip area, Through silicon via (TSV) is introduced to replace the large number of long interconnects needed in previous 2D structure. However, the thermal-mechanical reliability problems of TSVs, such as interfacial delamination, via cracking and so on, have become a serious reliability concern. In this paper,...
A proper orthogonal decomposition (POD) method is applied to a usual finite element scheme for two-dimensional solute transport problems such that it is reduced into a reduced finite element formulation with lower dimensions and high enough accuracy. Numerical examples show that the results of numerical computations are consistent with accurate solutions. Moreover, this validates the feasibility and...
One of the key research topics of the world's mining industry is how to ensure safe and reliable work of the powered supporot with large mining height more than 6m. During the process of design and development, the advanced CAD/CAE technique can be used to identify potential problems and increase the reliability of the powered support. In this paper, the whole 3D model of powered support with large...
In this paper, a segment extraction algorithm based on polygonal approximation for on-line Chinese characters recognition (OLCCR) is presented. With this method, the point with the smallest interior angle is detected and the whole stroke is split into two adjacent curves by this point-which is called as a cut-off point or an inflexion. To each of the two curves, the same step is performed to detect...
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