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Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys...
Tremendous effort is put into enhancing reliability of Ball grid array (BGA) solder joints. The BGAs are utilized as interconnection method in the electronic packaging industry due to its vast advancement in circuit miniaturization. New materials are introduced to further improve the reliability of the BGA solder joint. In this study, the stress response of BGA solder ball during vertical loading...
Wire bonding method are utilized to facilitate the interconnection in the demanding development of integrated circuits. Wire bond shear test method is utilized in the industry to scrutinize the quality of the wire bond. This paper discusses about the simulation of wire bond shear test using aluminium wire. This study is focused on evaluating the effects of bond pad surface on the stress response of...
A piezoresistive sensing resistor in MEMS square diaphragm has been studied using the MEMCAD 4.0 suite of tools, and in particular the piezoresistive module. It is seen that the effect of resistor size and position significantly effects the performance and behavior of the sensor. A 0.55 MPa pressure is used for the simulation on a 500um to 200um wide square shape diaphragm with 50um in thickness....
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