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Wire bonding method are utilized to facilitate the interconnection in the demanding development of integrated circuits. Wire bond shear test method is utilized in the industry to scrutinize the quality of the wire bond. This paper discusses about the simulation of wire bond shear test using aluminium wire. This study is focused on evaluating the effects of bond pad surface on the stress response of...
This paper presents an Advanced Encryption Standard (AES) encryption core on Field Programmable Gate Array (FPGA). The target device is Spartan-3 FPGA. We have designed an efficient and compact, iterative architecture with input and key, both of 128 bits. The throughput achieved is 2640.3712 Mbps with a frequency of 206.28 MHz; using 8 embedded Block RAMs (BRAMs) and 390 Slices. The aim is to provide...
We describe L1 cache designed for QUALCOMM??'s latest-generation digital signal processor (DSP) core. The cache is 32KB with variable associativity (4 to 16 ways) and is pseudo-dual-ported. Dual access is achieved by banking the cache in a way that minimizes bank conflict to less than 1%. The cache operates at 600 MHZ under worst-case PVT conditions and dissipates 100.8 pJoule per access at 1.2V....
SRAMs typically represent half of the area and more than half of the transistors on a chip today. Variability increases as feature size decreases, and the impact of variability is especially pronounced on SRAMs since they make extensive use of minimum sized devices. Variability leads to a large amount of guard banding in the design phase in order to meet frequency and yield targets. We develop an...
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