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The interfacial reaction between OSP, electrolytic Ni/Au, and electroless Ni/Pd/Au surface finish and SnAgCu solder on BGA package were investigated. After multiple reflows, IMC morphology and composition is examined by SEM and EDX. Cu6Sn5 formed between LF35 and OSP finish, and Ag3Sn were found disperse in the solder. Both (Nix,Cu1-x)3Sn4 and (Cux,Ni1-x)6Sn5 were observed on interface of electrolytic...
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