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Platinum TSVs compatible with harsh-environment post-processing were fabricated on an SOI wafer. This study was part of a larger project for the development of a SWCNT resonator, 3D-integrated, in a “via-first” approach, with its driving electronics. After their passivation, they are compatible with the harsh-environment post-processes necessary for the fabrication of the SWCNT resonator: the growth...
We report on harsh-environment-compatible Pt-TSVs forming ohmic contacts with a highly doped bulk silicon. They were developed as a part of a Single Wall Carbone NanoTube (SWCNT) resonator device with 3D-packaging. The fundamental properties of the TSVs, experimentally obtained with bulk Si instead of the real working device, are presented. Our concept for the device fabrication is “via first”, followed...
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