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Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240 mum times 160 mum. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining...
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