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“Reservoir unsealed” and “boundary layer separation” are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different...
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