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Failure behaviors of anisotropic conductive film (ACF) and non-conductive film (NCF) interconnects were investigated by measuring the connection resistance. The four-point probe method was used to measure the connection resistance of the adhesive joints constructed with Au bump on Si chip and Cu pad on flexible printed circuit. The interconnection reliability was evaluated by multiple reflow process...
The radio frequency (RF) and high frequency performance of the flip chip interconnects with anisotropic conductive film (ACF) and non-conductive film (NCF) was investigated by measuring the scattering parameters (S-parameters) of the flip chip modules. The effects of two chip materials, Si and gallium arsenide (GaAs), and of the metal pattern gap between the signal line and ground plane in the coplanar...
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