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In this paper, we conduct simulation of MEMS pressure sensors based on graphene membrane by using COMSOL finite element software and comparatively study the deflection and stress distribution of rectangular and circular vacuum cavities applied by a pressure. we also analyze the change rule of graphene membrane stress and maximum deflection distance for the two kinds of pressure sensor with different...
During SOI-based gyroscope fabrication, wet etching in hydrofluoric acid is utilized to etch buried oxide layer(BOX) and release micro-structures of the gyroscope. The BOX layer is beneath the micro-structures, and it's not easy to observe when the release process is finished, so a gradual release experiment is conducted to find the right etch time. Release experiment is carried out in two kinds of...
In this paper, experiments were carried out to fabricate a kind of free-standing silicon nitride thin film which was applied to many MEMS devices, especially for the gas flow sensors and Pirani. A series of manufacturing processes were researched and optimized to obtain perfect experimental results. LPCVD silicon nitride, dry etching silicon nitride and wet etching silicon were carefully studied in...
3D integration and packaging with through silicon via (TSV) is a promising method to overcome the limitation of integration scale in Micro-Electro-Mechanical Systems (MEMS) packaging. It is helpful to realize high density and reliability micro-devices. The technology of fabricating copper (Cu) TSVs by electroplating is applied to provide signal connection in vertical direction. However, the fabrication...
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