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The microstructure, the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni (SACBN) and Sn3.0Ag0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase, and that the eutectic phase is made of β-Sn, well-ditributed needlelike Ag3Sn, granular (Cu, Ni)6Sn5 and minor granular Bi....
This paper gives a detailed investigation on TSOP warpage mechanism. The influences of all the factors on warpage behavior, including materials (EMC ingredient and lead frame), lead frame design and assembly process, were investigated through numerical simulation and experimental study. The simulation result showed that low CTE material is a good choice for warpage reduction. And it also indicated...
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