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Novel high-frequency ultrasonic transducers have been developed in order to provide faster, more repeatable and stronger microelectronics bonding technology, and fine-pitch packaging can be accomplished by these transducers. The analytical model of the transducer system is established on the basis of electromechanical equivalent circuitry theory, vibration theory and wave theory, which lays the foundation...
To provide faster, more repeatable and stronger MEMS packaging technology, the dynamic characteristics of ultrasonic transducers are studied using finite element method (FEM), and the ultrasonic generator for driving the transducer is also presented in this paper. The finite element model of the high frequency ultrasonic transducer was established by using ANSYS software, and the vibration characteristics...
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