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Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. Sn-Ag-Cu alloys have long been used as solder materials for the interconnections of microelectronic devices because of low melting temperature and good wettability. Many tensile tests were performed on Sn-3Ag-0.5Cu solder alloys at various strain rates and over a wide temperature...
The lead-free solders are adopted to avoid lead pollution in the past decades, however, the mechanical behaviors under complex loading are still requires further study. For example, change of environment temperature is one of the hazards affecting the electronics reliability, especially the temperature cycles which will increase the temperature damage rapidly and the working life could be reduced...
In the current research, a small strain multi-scale constitutive model based on self-consistent method is developed to describe the rate- and temperature-dependent behavior of cyclic deformed Sn-0.7Cu solder. A modification is proposed on the traditional elastic plastic self-consistent (EPSC) model to capture the elasto-viscoplastic behavior of Sn-0.7Cu solder. A modified Voce hardening law is proposed...
Thermal cycling is typical working environment of electronic chips due to electronic equipment power on-offs and thermal excursions. Accelerated thermal cycling is widely employed to strictly examine the electronic products for aerospace usage to simulate the actual thermal environment throughout the service life. In this study, the effect of thermal cycling to mechanical property of Sn-3.0Ag-0.5Cu...
Structural reliability issues attract more and more attentions with the rapid development of electronic packaging industry. As the most venerable part of electronic packaging structure, the mechanical reliability of solder joints is greatly relevant to the system reliability of electronic products. The mechanical properties of solder materials have to be reasonably evaluated if numerical simulations...
Solder joint integrity is recognized as a key issue in the reliability of electronic devices. In the past decades, SnAgCu eutectic based solders are replacing SnPb eutectic solders in the electronics industry. Although the Pb-free solder is usually regarded as having a higher melting temperature compared with traditional Pb-Sn eutectic solder, solder joints were generally operated at a high homologous...
Solder joint integrity is recognized as a key issue in the reliability of electronic devices. In the past decades, SnAgCu eutectic based solders are replacing SnPb eutectic solders in the electronics industry. Although the Pb-free solder is usually regarded as having a higher melting temperature compared with traditional Pb-Sn eutectic solder, solder joints were generally operated at a high homologous...
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