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2.5D IC integrates heterogeneous chips by interposer with the technologies of through silicon via and re-distribution layer on it. It has the structure that chips are stacked on interposer then mounted on substrate with numerous micro-bumps and C4 bumps. For 2.5D IC package development, warpage control and interlayer dielectric interface stress minimization for potential delamination risk elimination...
With the development of renewable energy technology, Doubly-Fed Induction Generators (DFIG) are widely used on wind farms. Faults of machines have a direct influence on the safety and effectiveness of the power grid. In order to explore failure mechanism, it is of great importance to study the DFIG fault simulation models and features. In this paper, a Finite Element Method (FEM) simulation model...
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