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We have developed a thin, low-thermal-resistance LSI package by embedding a high-pin-count LSI chip into ultra-thin build-up layers supported by Cu plate. The embedded LSI chip is a microprocessor with approximately 1500 pads and a thickness of 50 mum, and it is completely laminated by the first build-up epoxy resin. The total package thickness is only 0.71 mm including a 0.5-mm-thick Cu plate for...
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