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The thermal problem of 3D NoC system becomes severer than 2D NoC systems due to the different heat dissipation capability between each stacking die, which increases the power density and worsen the thermal issue. Hence, many Dynamic Temperature Managements (DTMs) are proposed to control the system temperature. The DTM is classified into temporal approaches and spatial ones by considering either only...
As the complexity of multicore system grows with respect to the technology development, the large power density of multicore systems makes the thermal problems become severer. To prevent the multicore systems from overheating, in the practical way, some thermal sensors, sensing temperature at few selected locations, are embedded in the system. Then, the sensing temperatures are used to perform dynamic...
The increasing power density and time-varying workload distribution lead to runtime thermal hotspot in the modern multicore systems. To solve the thermal problems of the multicore systems, many dynamic thermal managements (DTMs) were proposed in recent years. These DTMs rely on the temperature sensing accuracy of the on-chip thermal sensors. However, due to the physical or economical constrains, the...
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