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This paper presents a physical-aware diagnosis technique for failing dies with multiple interconnect defects, including open and bridging. Our diagnosis technique considers fault masking/reinforcement and Byzantine effects. We use a section, a piece of interconnect, as the physical-aware diagnosis unit. We adopt the Single Location in a Cluster (SLIC) technique, where sections with similar simulation...
Robust and reliable interconnect and effective heat management are two major concerns in the high-speed and highpower integrated circuit. Carbon nanotube (CNT) exhibits amazing mechanical, thermal and electronic properties due to the unique structure. Those superior features make CNTs preferable and promising for application in electronic components and devices. In the present paper, carbon nanotube...
With the minimization development of electronic devices and products, nanotechnology and nanomaterials are widely applied in different fields of electronic packaging. Carbon nanotube (CNT) is an ideal material due to its excellent electrical and thermal conductivities. In the present paper, the application of CNT bundles as chip bumps was experimentally investigated. The electrical resistances of...
With the trend towards high performance, portability and low cost for electronic products, the packaging density in microsystem has become higher and the components have tended to be minimal. Flip-chip technology is superior because of its high packaging density and speed signal processing. There is an increasing interest in using electrically conductive adhesives as the interconnection material in...
The contribution focuses on applying micropolar theory which, as compared to the classical continuum theory, can offer the possibility to include e.g. a microstructural size-effect for the simulation and prediction of the interfacial stresses of microsystem interconnections, such as anisotropically conductive adhesives. As the dimension of the adhesive is much smaller than the chip or the substrate,...
Anisotropic conductive adhesives (ACAs) are widely used in microsystem packaging as interconnection materials, and many studies have been done about their electrical features, but limited works have been done on the mechanical properties with respect to the overall reliability of the packaging, and even less attention is paid to the micro-scale constituents of the internal structures in the ACA interconnection...
The increase in microsystem packaging density sets the requirement for component sizes in the system to become smaller and smaller. The scale decrease makes the analysis more complicated as the corresponding resolution should be improved to a great extent. Interconnection in the system is a typical interface structure that widely appear in the packaging system, in which periodic microstructures may...
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