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A new type of 3D multichip module (3D-MCM) for wireless sensor network was developed based on a kind of embedded FR-4 substrate for the wireless sensor network, in which FCOB (flip-chip on board), COB (chip on board), BGA (ball grid array) technologies, wirebonding and flip-chip interconnection technologies were combined together. The PBGA device and bare die were hybrid-integrated on the embedded...
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