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We have successfully mass-produced novel stacked back-illuminated CMOS image sensors (BI-CIS). In the new CIS, we introduced advanced Cu2Cu hybrid bonding that we had developed. The electrical test results showed that our highly robust Cu2Cu hybrid bonding achieved remarkable connectivity and reliability. The performance of image sensor was also investigated and our novel stacked BI-CIS showed favorable...
Through silicon via (TSV) is one of the necessary technologies for three-dimensional integration of LSIs. Heterogeneous system integration is a good candidate for its application, which includes the "Vision Chip". TSV technology is applied to a CMOS imager sensor camera module for mobile handsets and successfully achieves a size reduction of 55% in volume and 36% in footprint, which we refer...
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