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For a limited solder volume interconnect structure, bump interconnect reliability is more sensitive to the growth behavior of the interfacial intermetallic compounds(IMCs). The study of the effect of solder cap thickness on the interfacial diffusion reaction is of great importance to the application of copper pillar bump. Here, we investigated the effect of different solder cap thicknesses on IMCs...
Ni nanocones field emission arrays (FEAs) were fabricated by electro deposition. Morphologies of the Ni nanocone arrays were investigated by scanning electron microscope (SEM). Field emission properties of these arrays were tested by a vacuum field emission measurement system. The Ni nanocone arrays had low turn-on fields of 5-6.7 V/mum (corresponding to an emission current of 1 muA) and large currents...
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